Plate aluminum nitride

high thermal conductivity

With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components. Aluminum Nitride Ceramics exhibit exceptional characteristics as below: Good mechanical properties, Higher flexural strength than Al2O3 and BeO ceramics, High temperature and corrosion resistance. High thermal conductivity combined with good electrical insulation characteristics. Exceptional stability when exposed to many molten salts. Thermal stability up to at least 1500°C Favorable mechanical characteristics extending into the high temperature range. Low thermal expansion and resistance to thermal shock. Special optical and acoustic characteristics.