Innovacera supply the Porous ceramic plate/disc for Vacuum Chuck, which is mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation, and so on.
Only one size in stock (Dia200*T3mm, 15um), custom size is available.
Main Application field:
— New and refurbished, porous ceramic chucks for Disco, ADT, K & S, Applied materials TSK, OKAMOTO, Micro Automation, Load Point, etc. dicing saws and grinders.
— 6″, 8,” 12″ are regular sizes, And pore size include 15um, 30um, 50um, 100um.
Materials are alumina (Color: white, light brown, dark brown, blue-gray)
— Custom size (like square, oval shape, or irregular shapes) is available for us.
Characteristics include:
High flatness and parallelism
Compact and uniform microstructure with high strength
Good permeability and uniform adsorption affinity
Long lifetime
Dressing easily.