Substrate for the electronics industry

aluminum oxidethick-filmthin-layer

Alumina Oxide is one of the most cost-effective and widely used substrate materials in microelectronic applications. While many customers will be satisfied with an as-fired surface for their applications, there are four major benefits of ceramic substrate polishing: Finer Line Patterns After the fine grinding and polishing process, the ceramic substrate can get finer pattern lines, which is beneficial to the denser circuit design ability and is conducive to fine-pitch, high-density interconnection circuits. An as-fired surface finish is generally adequate for lines as thin as 1 mil in thin-film applications and 5 mils in thick-film applications. Forming finer lines than these on as-fired surfaces will exhibit poor pattern definition resulting in increased conductor resistance, which inhibits current flow and reduces circuit performance. Poor pattern definition can also contribute to performance anomalies in RF and microwave circuits, so we will polish it. Better Top and Bottom Surface Parallelism Grinding and polishing the substrate can improves the parallelism between the top and bottom surfaces. The benefit is that the capacitance and inductance of the substrate can be more tightly controlled when the substrate is metalized and patterned. Since capacitance and inductance are the main factors determining impedance, increased parallelism can improve the predictability and performance of RF and microwave circuits.