Disks aluminum nitride

hot-pressed

Some extreme environments require the high electrical resistivity in additional to exceptional thermal conductivity, high abrasive and high-temperature thermal cycling. To solve this kind problem, Innovacera provides Hot-pressed aluminum nitride ceramic material as solutions. Innovacera Hot pressed ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering. After high temperature and high pressure, hot pressed ALN ceramic part mechanical strength and hardness are better than the tap-casting molding process and cold isostatic press method. Innovacera can provide the maximum size of hot-pressed aluminum nitride ceramic part is Length 500 x width 500 x height < 350 mm and Outer diameter 500 x height < 500 mm Hot- Pressed aluminum nitride ceramic components features: Excellent thermal conductivity High electrical insulation High dielectric strength Resist high temperature and corrosion Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors Suit for rigorous or abrasive environments Can’t be eroded by all kinds of molten metals and molten hydrochloric acid. Hot- Pressed aluminum nitride ceramic part application: Semiconductor heaters Magnetic resonance imaging equipment Etching machine Integrated circuit part Structural packaging materials High-power heat dissipation insulating substrates Microwave window materials Compound semiconductor single crystal growth crucible Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.