Thermal pad

ceramic

Alumina Ceramic Thermal Pads are designed to provide a preferential heat-transfer path between heat-generating components, power switches, heat sinks, and other cooling devices. Alumina ceramic (Al₂O₃) thermal pads are renowned for their exceptional thermal conductivity and electrical insulation properties. Alumina ceramics exhibits thermal conductivity ranging from 20 to 30 W/m·K, allowing for efficient heat dissipation in high-power applications. This critical feature prevents overheating, enhancing the reliability and longevity of electronic components. Additionally, alumina’s high melting point and chemical stability make it suitable for harsh environments, ensuring these thermal pads maintain performance even under extreme conditions. TO 247 alumina ceramic thermal pads typically used in the power switches, Integrated Circuit Chip, Packaging Heat Conduction, IGBT Transistor Heat Sink MOS Transistor, MOSFET Transistor Heat Sink Interface, LED Board TIM ( Thermal Interface Material ), COF Heat (Chip ON Film), and various electronic devices where effective heat management is crucial. Their excellent electrical insulation properties make them particularly well-suited for applications requiring high insulation resistance and low thermal resistance, such as power supply modules, inverters, and electric vehicle (EV) drive systems. As the demand for efficient thermal management solutions grows, TO 247 alumina ceramic thermal pads are increasingly integrated into designs for high-performance power electronics.