Rated Random Recurring Peak Impulse Power Dissipation(PPPM)(10 / 1000µs): 600 W
Features
● Low incremental surge resistance
● Excellent clamping capability
● Low profile package with built-in strain relief
● Typical IR less than 1.0 μA above 10 V
● 600 W peak pulse power capability with a 10/1000 μS
Waveform
● For surface mounted applications to optimize board space
● Typical failure mode is short from over-specified voltage
or current
● IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
● EFT protection of data lines in accordance with IEC 61000
-4-4
● Very fast response time
● Glass passivated chip junction
● High temperature to reflow soldering guaranteed: 260
°C/30 sec
● Plastic package is flammability rated V-0 per Underwriters
Laboratories
● Meet MSL level1, per J-STD-020
● Matte tin lead–free plated
● Halogen free and RoHS compliant
● Pb-free E3 means 2nd level interconnect is Pb-free and
the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)