Clamshell THT socket solution suitable for QFP, SOP and PLCC packages
Pitch from 0.40 mm up to 1.27 mm standard
Cantilever stamped contact type
IC orientation, Live bug
A solid concept able to accommodate different package types, size, pitch and thickness
Socket outline according to package size
A solid concept able to accommodate different package types, size, pitch and thickness
Socket outline according to package size
Solution suitable for manual handling
Cantilever stamped single tip contact
Exposed pad connection optional
Mating Cycles
10,000
Operating Temperature Range
-55 °C – 170 °C
(Initial) Contact Resistance
30 Milliohm
Insulation Resistance
1000 Megaohm
(Dieletric) Withstanding Voltage
700 V AC
Current Rating
1 A
Pitch
1.27
Pin Count / Numbers of pins
124