Open top THT socket solution suitable for BGA packages with 0.50 mm pitch
2-point Tweezer Style contact system to nip the sides of solder balls to prevent damages of co-planarity of solder balls
Open Top solution suitable for autoloading
Compact dimensions to maximize BIB density
Easy handling for manual operation too
Mating Cycles
10,000
Operating Temperature Range
-40 °C – 150 °C
(Initial) Contact Resistance
100 Milliohm
Insulation Resistance
1000 Megaohm
(Dieletric) Withstanding Voltage
100 V AC
Current Rating
1 A
Pitch
0.5
Pin Count / Numbers of pins
300