Integrated circuit socket NP506-Series

SMT

Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness Active alignment for IC package positioning Cantilever stamped contact type structure Centre signal contacts (thermal / electrical) available for exposed pads Squared compact dimensions suitable for automatic loading operation Selectable cover outline size (25 x 25 sqmm and 27 x 27 sqmm) Twin beam stamped contact to guarantee electrical signal stability 4 latches package warping manage Package Centering Mechanism option Ground Pin optional Mating Cycles 10,000 Operating Temperature Range -40 °C – 150 °C (Initial) Contact Resistance 100 Milliohm Insulation Resistance 1000 Megaohm (Dieletric) Withstanding Voltage 100 V AC Pitch 0.4 Pin Count / Numbers of pins 88