Integrated circuit socket NP291-Series

BGA

Open top THT socket solution suitable for BGA packages with 0.80 mm pitch Self-contacting structure without upper pressing force (ZIF) Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity of solder balls Open Top solution suitable for a huge variety of BGA packages up to 25 x 25 sqmm outline dimensions Different socket outline dimensions in order to fit the packages Suitable for autoloading testing equipment Mating Cycles 10 Operating Temperature Range -55 °C – 150 °C (Initial) Contact Resistance 100 Milliohm Insulation Resistance 1000 Megaohm (Dieletric) Withstanding Voltage 100 V AC Current Rating 1 A Pitch 0.75 Pin Count / Numbers of pins 500