BGA socket NP276-Series

Open top THT sockets for BGA packages with 1.27 mm pitch Secure package alignment due to self-contacting structure without upper pressing force (ZIF) Tweezer contacting structure to nip the sides of solder balls to prevent damages of co-planarity Open Top solution suitable mainly for large BGA packages Different socket outline dimensions in order to fit the packages Suitable for autoloading testing equipment Mating Cycles 10,000 Operating Temperature Range -55 °C – 150 °C (Initial) Contact Resistance 30 Milliohm Insulation Resistance 1000 Megaohm (Dieletric) Withstanding Voltage 100 V AC Current Rating 1,5 A Pitch 1.27 Pin Count / Numbers of pins 1,105