The signal processing system has large heat flux density and compact space. However, its thermal control problems are prominent. The phase-change cold plate is generally designed to be"split" with the signal processing part, that is,the heat dissipation is independent of functional part. The phase-change cold plate is filled with high enthalpy phase-change materials and contains fins inside to enhance heat transfer,which can meet the heat dissipation requirements under a certain power within a certain period of time. The phase-change cold plate and the signal processing plate are connected by thermal interface materials such as thermal conductive pad, thermal conductive gel and thermal conductive silicone grease.