Diamond wire cutting machine

waferfor industrial applications

silicon wafer cutting line - wire size range (0.06mm-0.080mm) - diamond wire size range: (0.075mm-0.099mm diamond wire size range: (0.19mm-0.260mm) - diamond wire size range: (0.350mm-0.450mm) - environmental cutting, improvement of cutting efficiency - environmental friendly, recyclable cutting - for cutting of single crystal and polycrystalline silicon in photovoltaic industry cutting of illumination and photography equipment sapphire cutting of polycrystalline silicon ingot, sapphire spindle