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Diamond wire cutting machine waferfor industrial applications
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Characteristics
- Technology
- diamond wire
- Product handled
- wafer
- Applications
- for industrial applications
Description
silicon wafer cutting line -
wire size range (0.06mm-0.080mm) -
diamond wire size range: (0.075mm-0.099mm
diamond wire size range: (0.19mm-0.260mm) -
diamond wire size range: (0.350mm-0.450mm) -
environmental cutting, improvement of cutting efficiency -
environmental friendly, recyclable cutting -
for cutting of single crystal and polycrystalline silicon in photovoltaic industry
cutting of illumination and photography equipment sapphire
cutting of polycrystalline silicon ingot, sapphire spindle
Other Zhejiang Tony Electronic Co., Ltd. products
Diamond cutting line
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.