GAOCE metal cutting machines

Tube diameter: 301 mm
Cutting speed: 2,100 m/min
Overall length: 5,400 mm

The product is a special processing equipment that USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm ...

Cutting speed: 0 mm/min - 900 mm/min
Overall length: 5,000 mm
Overall width: 2,560 mm

... processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond ...

Photovoltaic Cutting Equipment General description: Launched in 2022, this product is designed for silicon rod cutting, with the featuring advantages of high yield, small slope, less edge chipping, ...

This is single knife cutter used to process round rods up to 3m, launched in 2023. This product has high degree of automation, flexible and convenient processing, and can process longer rods by adding expansion bracket.

This is single knife cutter used for reverse cutting and sampling of round or square rods, launched in 2022. This product is easy and convenient to operate, with rich functions. It can be equipped with ...

Cutting speed: 2,400 m/min
Overall length: 6,250 mm
Overall width: 3,400 mm

With the world's first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting ...

Weight: 16,500 kg

... adopts a brand new cutting area layout,with a maximum silicon rod loading capacity of 950mm long; lt is equipped with newhigh-precision oil and gas bearing boxes, more advanced tension control algorithms.high-precision ...

Tube diameter: 201 mm
Cutting speed: 0 mm/min - 3 mm/min
Overall length: 5,400 mm

The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon rods with diameter of 6 inches and 8 inches; the ...

Tube diameter: 6 in - 8 in
Overall length: 4,880 mm
Overall width: 2,100 mm

This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible with 6 inches ...

Tube diameter: 192 mm - 202 mm
Overall length: 4,300 mm
Overall width: 2,000 mm

... tension regulation; via adjusting the structure design for key components, the following cutting requirements can be met, maximum 50N cutting tension, 2400m/min wire speed and 700mm rod length.