GAOCE monocrystalline silicon cutting machines

Photovoltaic Cutting Equipment General description: Launched in 2022, this product is designed for silicon rod cutting, with the featuring advantages of high yield, small slope, ...

Cutting speed: 2,400 m/min
Overall length: 6,250 mm
Overall width: 3,400 mm

... first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting ...

Weight: 16,500 kg

... the slicing process of silicon wafer manufacturing. The product adopts a brand new platformized design and industry-leadingadjustable small wheelbase design, which can be compatible with the cutting needs ...

Tube diameter: 301 mm
Cutting speed: 2,100 m/min
Overall length: 5,400 mm

... USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm ...

Cutting speed: 0 mm/min - 900 mm/min
Overall length: 5,000 mm
Overall width: 2,560 mm

... processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing ...

Tube diameter: 201 mm
Cutting speed: 0 mm/min - 3 mm/min
Overall length: 5,400 mm

The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon ...

Tube diameter: 6 in - 8 in
Overall length: 4,880 mm
Overall width: 2,100 mm

This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible ...