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- HG Farley LaserLab Co
HG Farley LaserLab Co single-phase cutting machines
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
X travel: 300 mm
Y travel: 400 mm
Laser power: 10 W
FPC laser cutting machines adopt high-performance cold laser source, perfectly achieving the board shape cutting, contour cutting, drilling and cover film cutting ...
Farley Laserlab
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X travel: 4,000 mm
Y travel: 2,500 mm
Z travel: 850 mm
The SF4025G 3D five-axis laser cutting machine is designed for customers in the fields of moulds, prototypes, automotive parts and machining stations to solve the 3D cutting ...
Farley Laserlab
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X travel: 300 mm
Y travel: 300 mm
Laser power: 10 W
The Solar PV-Screen Printing Grid Version Film Cutting Equipment is used for laser patterning of thin films for the upstream photovoltaic grid manufacturers. It consists of a quartz frame, XY linear motor platform, vision ...
Farley Laserlab
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pulsed fiber laser cutting machine
Laser power: 40 W
Repeatability: 0.2 mm
Overall length: 3,700 mm
... • Adopting an imported picosecond/short pulse width laser, good beam quality, small focus spot, high stability • The machine can be equipped with a multi-vibration lens system to reduce the laser processing time ...
Farley Laserlab
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X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab

X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab
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X travel: 200 mm
Y travel: 300 mm
Repeatability: 2, 5 mm
Nanosecond laser is used for precise dicing of GPP wafers. Product advantages: • High processing quality The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ ...
Farley Laserlab

X travel: 650 mm
Y travel: 550 mm
Maximum cutting height: 1 mm
... film cutting, FPC shape cutting, FPC window half cutting and RFPC cover opening etc. It has high accuracy, high stability and consistent cutting HAZ effect. Mainly ...
Farley Laserlab
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