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... called EP31ND. This robust product profile allows EP31 to be considered for use in aerospace, electronic, optical, opto-electronic, specialty OEM and related industries.
Master Bond
Key Features • Exceptionally low viscosity • Superior thermal stability • Very little shrinkage upon cure • Cationic curing system Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, ...
Master Bond
Key Features • Good physical strength properties • Low shrinkage upon curing • Cationic curing system, no oxygen inhibition • Passes NASA low outgassing tests Master Bond UV16 is a low viscosity, high strength epoxy based UV curable ...
Master Bond
Key Features • Meets NASA low outgassing requirements • Superior chemical resistance • Moderate viscosity • High dimensional stability Master Bond UV24TKLO is a one part UV curable epoxy modified formulation for ...
Master Bond
... cyanoacrylate type adhesive. This high strength, rapid curing system is used primarily for medical device assembly. MB297Med is a higher viscosity (2,200-2,400 cps) cyanoacrylate. This kind of system, which is commonly ...
Master Bond
... conditions. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE-LO is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along ...
Master Bond
... promoter, allowing adhesion to this low energy type of plastic (polyolefin) in a process that is relatively simple and straightforward. X21 can also be used as an adhesive for bonding one polyolefin ...
Master Bond
... • Excellent electrical insulation properties • Uniform bond line thickness Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class ...
Master Bond
... well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. The service temperature range for this system is from -100°F to +400°F. It has very good chemical ...
Master Bond
... environmental conditions and it is widely used for bonding and sealing of electronic components, electrical devices, a variety of electro-optical systems and for special electronic circuitry.
Master Bond
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