Master Bond bonding adhesives

1 company | 27 products
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high-viscosity adhesive
high-viscosity adhesive
MB297Med

... cyanoacrylate type adhesive. This high strength, rapid curing system is used primarily for medical device assembly. MB297Med is a higher viscosity (2,200-2,400 cps) cyanoacrylate. This kind of system, which is commonly ...

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Master Bond
silicone adhesive
silicone adhesive
MasterSil 151TC

Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low ...

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Master Bond
UV-polymerized adhesive
UV-polymerized adhesive
UV22DC80-1

Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP42-2LV Black

... Meets NASA low outgassing specification Master Bond EP42-2LV Black is a room temperature curable, two component epoxy for bonding, sealing, coating and casting featuring very good chemical and temperature resistance. ...

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epoxy adhesive
epoxy adhesive
EP3HTS-TC

Working temperature: -80 °F - 400 °F

... syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material. It is serviceable from -80°F to +400°F (-60°C to +200°C).

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Master Bond
epoxy adhesive
epoxy adhesive
EP40TC

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. It combines convenient processing with superior ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP41S-5Med

Working temperature: -80 °F - 450 °F

... EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP5LTE-100

Working temperature: -60 °C - 175 °C

... glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP21ARHTND-2

Working temperature: -60 °F - 400 °F

Two component epoxy adhesive, sealant and coating featuring exceptional resistance to acids Key Features * Paste consistency * Convenient handling * Superior temperature resistance * Good physical strength properties EP21ARHTND-2 ...

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Master Bond
epoxy adhesive
epoxy adhesive
EP30-4Med

Working temperature: -50 °F - 250 °F

... system meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. It can be used for bonding, sealing, and small encapsulation applications. It can also be utilized as a coating, especially ...

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Master Bond
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