Master Bond thermally-conductive adhesives

Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master ...

... temperature resistant • Thermally conductive • Tough and flexible • Easy to apply and doesn’t require freezing • Excellent electrical insulation properties • Uniform bond line thickness Master ...

... prominent use is as a glob top material, it also can be utilized as a die attach, potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA ...

Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical ...

Key Features - Available in 30 gram preforms - High temperature resistant - Thermally conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - ...

... type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good ...

Working temperature: -80 °F - 400 °F

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at ...

... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the ...

Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 ...

... a specialty formulation that can be used for bonding, coating, sealing and encapsulation. When used as an adhesive, the thermally conductive filler has very fine particle sizes; subsequently, ...