SCHROFF AdvancedTCA platforms
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Conforms to AdvancedTCA Standard PICMG 3.0 rev.3.0 Input voltage 200 ... 240 VAC, 3 x IEC 320‐C20 AC mains plugs (please order AC plug-in power supply unit separately); 3 slots for 3 plug-in PSUs for 2 + 1 redundancy ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage -48 VDC/ -60 VDC, two redundant power entry modules (PEM) Redundant hot-swap fan trays, airflow from bottom front to top rear; air filter access ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev.3.0 Input voltage 200 ... 240 VAC, 2 x IEC 320-C20 AC mains plugs (please order AC plug-in power supply units separately) Two hot swap fan trays, airflow from right ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage -48 VDC/-60 VDC, two redundant power connections with fuse and switch Two hot-swap fan modules on rear of case, airflow from front to rear; air filter ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev.3.0 Input voltage -48 VDC/-60 VDC, two redundant power entry modules (PEM) 2 redundant hot‐swap fan trays in push‐pull configuration, airflow from bottom front to top rear 450 ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage 200 ... 240 VAC, two redundant power entry modules (PEM), can optionally be equipped with 2 redundant DC PEMs Two hot swap fan trays, airflow from ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage -48 VDC/-60 VDC, two redundant power entry modules (PEM), can optionally be equipped with 2 redundant AC PEMs and up to 4 AC PSUs Two hot swap fan ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Non-hot-swap PEM at chassis rear A fan module under the card cage featuring an integrated, replaceable air filter, RJ45 sockets for connecting serial interfaces ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage 100 ... 240 VAC input voltage, two redundant power entry modules (PEMs) each 1200 W (1000 W at 110 V), optionally equipped with 2 redundant DC PEMs Two ...
nVent Schroff GmbH
Conforms to AdvancedTCA Standard PICMG 3.0 rev. 3.0 Input voltage -48 VDC/-60 VDC, two redundant power entry modules (PEM), optionally equipped with 2 redundant AC PEMs Two hot swap fan trays, airflow from right to ...
nVent Schroff GmbH
19” Rackmount, 15U height, 470mm depth 14-slot dual-star topology Fabric Interface 14-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
19” Rackmount, 14U height, 470mm depth 14-slot dual-star topology Fabric Interface 14-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
19” Rackmount, 6U height, 438mm depth 6-slot dual-star topology Fabric Interface 6-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
19” Rackmount, 6U height, 438mm depth 6-slot dual-star topology Fabric Interface 6-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
19” Rackmount, 3U height, 385mm depth 2-slot full-mesh topology Fabric Interface 2-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
19” Rackmount, 3U height, 385mm depth 2-slot full-mesh topology Fabric Interface 2-slot standard Rear Transition Module Dual-bussed IPMB Hot-swappable IPMC controlled fan trays Two shelf management controller ...
ADLINK TECHNOLOGY
The iTN221 is a “Pizza Box” 1.5U (full ETSI) sized, next generation multiservice access node. It offers a dual core architecture for both packet and SDH/TDM transmission. The iTN221 supports up to 2 x 1G and/ or 2 x STM-1/4 uplink capacities, ...
Your suggestions for improvement:
Receive updates on this section every two weeks.
Please refer to our Privacy Policy for details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group
Please specify:
Help us improve:
remaining